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SMD Package Technology
BCC: Bump Chip Carrier
BGA: Ball Grid Array; BGA graphic
BQFP: Bumpered Quad Flat Pack
CABGA/SSBGA: Chip Array/Small Scale Ball Grid Array
CBGA: Ceramic Ball Grid Array
CCGA: Ceramic Column Grid Array [A column of solder]
CERPACK: Ceramic Package
CFP: Ceramic Flat Pack
CGA: Column Grid Array
CLCC: Ceramic Leadless Chip Carrier Packages [CLCC BJT Graphic]
CLGA: Ceramic Land Grid Array [an LGA package]
CQFP: Ceramic Quad Flat Pack, [CQFP Graphic]
CQGP: Ceramic Quad [Gold Plating]
CSBGA: Cavity Down BGA
CSOP: Ceramic Small Outline Package
CSP BGA: Chip Scale Package BGA
LDCC: Ceramic Lead-Less Chip Carrier
DBS: DIL Bent SIL [In-line package with bent leads forming 2 rows]
DFN: Dual Flat Pack, No Lead
DLCC: Dual Lead-Less Chip Carrier (Ceramic) DLCC Graphic
DMP: Dual In-line Mini Molded Package
DQFN: Depopulated Quad Flat-pack; No-leads
EPTSSOP: Thin Shrink Small Outline Exposed Pad Plastic Packages
ETQFP: Extra Thin Quad Flat Package
FBGA: Fine-pitch Ball Grid Array
FCBGA: Flipchip BGA
FCPBGA: Flip Chip Plastic BGA
FFP: Flip-chip Fine Package
FleXBGA: Flexible Ball Grid Array
FLP: Flat Lead Package
FPBGA: Fine Pitch Ball Grid Array
HBCC: Heatsink Bottom Chip Carrier
HBGA: High Performance Ball Grid Array [higher heat dissipation]
HDIP: Heat-dissipating Dual In-line Package [appears as a standard DIP]
HSBGA: Heat Slug Ball Grid Array
[copper slug added to reduce thermal resistance]
HSOP: Heatsink Small Outline Package
HTSSOP: Heatsink Thin Shrink Small Outline Package
HUQFN: Heatsink Ultra-thin Quad Flat-pack; No-leads
HVQFN: Heatsink Very-thin Quad Flat-pack; No-leads
HVSON: Heatsink Very-thin Small Outline; No-leads
HWQFN: Heatsink Very-Very-thin Quad Flat-pack; No-leads
HWSON: Heatsink Very-Very-thin Small Outline package; No leads
HXQFN: Heatsink eXtremely-thin Quad Flat-pack; No-leads
HXSON: Heatsink eXtremely Small Outline Package; No leads
JDIP: J-Leaded Dual In-Line J-Lead DIP Picture
JLCC: J-Leaded Chip Carrier (Ceramic) J-Lead Picture
LBGA: Low-Profile Ball Grid Array
LCC: Leaded Chip Carrier LCC Graphic
LCC: Leaded Chip Carrier Un-formed LCC Graphic
LCCC: Leaded Ceramic Chip Carrier;
LCGA: Low-Profile Ball Grid Array;
LFBGA: Low-Profile, Fine-Pitch Ball Grid Array
LGA: Land Grid Array LGA Graphic
[Pins located on Mother board, not the device]
LLCC: Leadless Chip Carrier LLCC Graphic
LQFP: Low-profile Quad Flat pack
MCMBGA: Multi Chip Module Ball Grid Array
MCMCABGA: Multi Chip Module-Chip Array Ball Grid Array
MLCC: Micro Leadframe Chip Carrier
MLP: Micro Lead-frame Package MLP graphic
MQFP: Metric Quad Flat Pack [high pin count QFP]
MSOP: Mini Small Outline Plastic Packages
OBGA: Organic Ball Grid Array
ODFN: Optical Dual Flat No-Lead Plastic Package
PBGA: Plastic Ball Grid Array, PBGA graphic
PLCC: Plastic Leaded Chip Carrier
POS: Package on Substrate
PQFD: Plastic Quad Flat --
PQFP: Plastic Quad Flat Pack
PSOP: Plastic Small-Outline Package PSOP graphic
QFN: Quad Flat No-Lead
QFP: Quad Flat pack QFP Graphics
QSOP: Quarter Size Outline Package
SBGA: Super BGA - above 500 Pin count [Cavity down die]
SDMP: Shrink Dual In-line Mini Molded Package
SO Flat Pack: Small Outline Flat Pack IC
SOIC: Small Outline IC
SOJ: Small-Outline Package [J-Lead], SOJ
SOLIC: Small Outline Large Integrated Circuit (Gull-Wing Lead Wide Body)
SON: Small-Outline No-leads [leadless package]
SOP: Small Out-line Package
SSOP: Shrink Small-Outline Package
SOT: Small Outline Transistor Plastic Package [SOT-23 Graphic]
TBGA: Tape Ball Grid Array [Cavity-down thermally enhanced Flip Chip]
TBGA: Thin Ball Grid Array
TDFN: Thin Dual Flat No-Lead Plastic Package
TEPBGA: Thermally Enhanced Plastic Ball Grid Array
TFBGA: Thin profile Fine-pitch Ball Grid Array
TQFN: Thin Quad Flat No-Lead Plastic Package
TQFP: Thin Quad Flat Pack TQFP Graphic
TSOP: Thin Small-Outline Package
TSSOP: Thin Shrink Small-Outline Package
TSOT: Thin Small Outline Transistor Plastic Package
TVSOP: Thin Very Small-Outline Package
TVSP: Thin Very Small Package
UFBGA: Ultra Fine-Line BGA
UTDFN: Ultra Thin Dual Flat No-Lead Plastic Package
VFBGA: Very thin Fine-pitch Ball Grid Array
VQFB: Very-thin Quad Flat Pack
VSO: Very Small Outline
VSSOP: Very thin Shrink Small Outline Package
VSP: Very Small Package
XQFN: eXtremely thin Quad Flat package; No leads
XSON: eXtremely thin Small Outline package; No leads
